Substrate mounting device

ABSTRACT

A substrate mounting device for installing an electrical substrate to a carrier substrate. The substrate mounting device includes a plurality of guide rails mounted on the perimeter edge of the electrical substrate. First and second substrate guides are mounted to the carrier substrate in a spaced and parallel relationship to the other. Each substrate guide includes a channel extending longitudinally along a substrate guide inner side, from an open end to a top guide. The channel is further defined by a top surface and a plurality of drop guides which in turn form a plurality of slots. The electrical substrate is installed by manually inserting the electrical substrate into respective substrate guide open ends and manually pushing the electrical substrate along the channels until the substrate encounters a respective top guide. The top guides then urge the substrate downward until each electrical substrate guide rail falls into a respective substrate guide slot thereby, resting each of the electrical substrate&#39;s plurality of guide rails on the carrier substrate.

BACKGROUND OF THE INVENTION

This is a continuation-in-part of application 07/032,667 filed Apr. 1,1987 now abandoned.

This invention relates in general to modular electronic circuit devicesand more particularly to a device for mounting electrical substrates toa carrier substrate.

In the past few years, the use of plug-in units for electricalcomponents has found favor within the electronics industry. Such plug-inunits generally comprise a structure upon which are mounted electricalassemblies or sub-assemblies, the structure being arranged to be pluggedin a suitable socket provided on a base chassis. When so plugged thecomponents carried by the plug-in unit are electrically connected inproper circuit relation to other electrical equipment carried by thebase chassis.

Recently however, with the coming of film circuits, the need for aspecialized carrier structure for housing the sub-assembly hasdisappeared. This is mainly due to the smaller size of a film circuit.Compared to circuit fashioned in discrete components the film circuit isappreciably smaller and lighter. It is not uncommon to have filmcircuits plugged directly into larger circuit cards or other carriersubstrates and in turn the larger substrate plugged into the basechassis. At present, most installations of film circuits to circuitcards is done as a permanent installation. Therefore, removal andreplacement of the film circuits though not impossible, is a tedious andlabor intensive job.

It therefore is an object of the present invention to disclose a newstructure for mounting, electronic substrates onto carrier substrates.

SUMMARY OF THE INVENTION

In accomplishing the object of the present invention there is provided asubstrate mounting device for mounting an electrical substrate to acarrier substrate. The electrical substrate of the present inventionincludes a first pair of guide rails each mounted on the perimeter edgeof the electrical substrate directly opposite the other. A second pairof guide rails located in a spaced relationship from the first pair ofguide rails are also mounted on the perimeter edge of the electricalsubstrate directly opposite the other.

First and second substrate guides are mounted to the carrier substratein a spaced and parallel relationship to the other. Each of the firstand second substrate guides include a channel extending longitudinallyalong a first side thereof, from an open end to a top guide. The channelis further defined by a top surface and first and second drop guides.The first and second drop guides further define first and second slots.

The electrical substrate is mounted to the substrate guides by manuallyinserting the electrical substrate into respective first and secondsubstrate guide channels open ends and manually pushing the electricalsubstrate along the channels. The electrical substrate and first andsecond pairs of guide rails ride between respective first and seconddrop guides and top surfaces. When the substrate encounters the firstand second top guides each respective top guide urges the electricalsubstrate downward. The first guide rail and the second guide rail thenfall within respective first and second slots on each of the first andsecond substrate guides thereby, resting each of the first and secondelectrical substrate guide rails on the carrier substrate.

The electrical substrate can be provided with some means of electricalconnection device which would contact or mate with similar devicesmounted on carrier the substrate. This could provide for electricalconnections between the electrical substrate and the carrier substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the invention may be had from theconsideration of the following detailed description taken in conjunctionwith the accompanying drawing in which:

FIG. 1 is a perspective view of a substrate having the guide rails ofthe present invention installed thereon;

FIG. 2 is a perspective view of a substrate guide of the presentinvention;

FIG. 3 is a top plan view of the substrate mounting device of thepresent invention mounted on a carrier substrate.

FIGS. 4-7 are sectional views of the substrate mounting device of thepresent invention illustrating the manner in which a substrate isinstalled.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Turning now to FIGS. 1 and 2 of the included drawings the device inaccordance with the invention includes a planar substrate 10 havingforward guide rails 11 and rear guard rails 12 attached or molded ontothe substrate 10 along the edge of one of the substrates 10 major sides.A similar set of guide rails (not shown) is also positioned on theopposite major side of the substrate. As can be seen each guard rail end13 and 14 is angled so as to aid insertion and extraction when installedinto guide 20 of Fig.2.

Guide 20 is a integrally molded unit comprised of a slot or channel 24extending longitudinally along an inner side of guide 20. Channel 24 isdefined between a planar top cap or surface 29 and a rear drop guide 22and forward drop guide 23. Additionally, the channel 24 extends from anopening at the forward end of the guide 20 to a top guide 27 at the rearof the guide 20. Both the forward and rear drop guides include rampedends 28 to aid in the positioning and removal of the substrate 10.Further, the top guide 27 includes an angled surface 26 which also aidsin the installation of substrate 10 and which will be explained indetail later. Finally, guide 20 includes a generally planar bottomsurface 25 for mounting the guide to a carrier substrate.

A pair of guides 20 and 30 form the substrate mounting device of thepresent invention shown in FIG. 3. Guide 30 is a mirror image instructure to guide 20.

The substrate mounting device of the present invention is attached byany convenient means to the top surface of a carrier substrate 50 suchas a circuit card, backplane, or other electrical substrate.

Turning now to FIGS. 4-7 an explanation of the installation of thesubstrate 10 within the substrate mounting device of the presentinvention will be explained in detail. It should be noted that FIGS. 4-7show the installation in sectional view and therefore only guide 20 isshown. It will be appreciated by those skilled in the art that anidentical insertion procedure occurs simultaneously in guide 30 as thesubstrate is installed.

Beginning at FIG.4 the substrate 10 including rear guide rail 12 andforward guard rail 11 is inserted into channel 24 of guide 20 and pushedforward within the guide. As can be seen the real rail 12 rides withinthe channel between the forward drop guide 23, rear drop guide 22 andthe top cap 29. The rear guide rail 12 being longer than the rear slot53, which is defined by the rear drop guide 22 and forward drop guide23, rides over the forward slot 53 on insertion.

As the substrate 10 is installed further into guide 20 substrate guiderail 11 and 12 fall into slots 53 and 52 respectively, as illustrated inFIG. 5. This is aided by angled surfaces 13 of guide rails 11 and 12sliding down angled surfaces 28 of drop guides 23 and 22.

Angled surface 26 of top guide 27 insures that substrate 10 follows adownward motion as it is further pushed within the guide as shown inFIG. 6.

Finally, the substrate is fully installed when the forward rail 12 andrear rail 11 rest on the carrier substrate 50 top surface withinrespective slots 52 and 53. The forward end of substrate 10 rests on atop surface of bottom member 42 when fully installed.

It will be appreciated by those skilled in the art that the substrate 10can be provided with some means of electrical connection devices whichwould contact or mate with similar devices mounted on carrier substrate50. This would provide electrical connection between substrate 10 andthe carrier substrate 50.

The substrate is easily removed by pulling the substrate 10 out of theguide 20 in an opposite direction to that of installation. A liftingaction is provided by angled ends 13 of substrate rails 11 and 12 ridingon angled ends 28 of drop guides 23 and 22. Once the substrate 10 andrails 11 and 12 are within channel 24 the substrate is pulled andwithdrawn from the guide.

Although the preferred embodiment of the invention has been illustrated,and that form described in detail, it will be readily apparent to thoseskilled in the art that various modifications may be made thereinwithout departing from the spirit of the invention or from the scope ofthe appended claims.

What is claimed is:
 1. A substrate mounting device for mounting anelectrical substrate to a carrier substrate comprising:a first pair ofguide rails each mounted on the perimeter edge of said electricalsubstrate directly opposite each other; a second pair of guide railslocated in a spaced relationship to said first pair of guide rails andeach guide rail of said second pair of guide rails mounted on theperimeter edge of said electrical substrate directly opposite eachother; first and second substrate guides mounted to said carriersubstrate in a spaced and parallel relationship to each other, each ofsaid substrate guides including a channel longitudinally oriented alonga first side thereof, and each of said channels including an open endand a top guide, and each channel extends between said open end and saidtop guide, said first and second substrate guide channels furtherdefined by a top surface and first and second drop guides, said firstand second drop guides located opposite said top surface, and said firstand second drop guides further defining first and second guide railreceiving slots; said electrical substrate and said first and secondguide rails arranged to be manually inserted into respective first andsecond substrate guide channels at respective channel open ends andmanually pushed along said channels riding between respective first andsecond drop guides and channel top surfaces until said substrateencounters a respective top guide whereby, said first guide rail andsaid second guide rail fall within respective first and second guiderail receiving slots on each of said first and second substrate guides,resting each of said first and second electrical substrate guide railson said carrier substrate.
 2. A substrate connector guide for mountingand electrically connecting an electrical substrate to a carriersubstrate comprising:first rail means mounted on a first perimeter edgeof said electrical substrate; second rail means mounted on a secondperimeter edge of said electrical substrate directly opposite said firstrail means; first and second guide means mounted to said carriersubstrate in a spaced and parallel relationship to each other, each ofsaid guide means including a channel extending longitudinally along afirst side thereof and said channel extends between an open end and aterminating end, each channel including at least one rail meansaccepting slot; and, said electrical substrate and said first and secondrails means arranged to be manually inserted into respective first andsecond substrate guide means channels at respective channel open endsand urged along each of said guide means channels toward saidterminating end until said first rail means and said second rail meansfall within respective first and second rail means accepting slots,resting each of said first and second rails means on said carriersubstrate.
 3. The substrate connector guide as claimed in claim 2,wherein: said first rail means is a pair of guide rails mounted intandem and extending from the bottom surface of said electricalsubstrate.
 4. The substrate connector guide as claimed in claim 3,wherein: said second rail means is a pair of guide rails mounted intandem and extending from the bottom surface of said electricalsubstrate directly opposite of said first rail means along a secondmajor perimeter edge of said electrical substrate.
 5. The substrateconnector guide as claimed in claim 4, wherein: each of said first andsecond guide means channels is defined by a top surface and first andsecond drop guides positioned in tandem along said channel, said guidemeans first and second drop guides further defining first and secondslots.
 6. The substrate connector guide as claimed in claim 5, wherein:said electrical substrate and said first and second pair of guide railsare inserted within respective first and second guide means channels atrespective channel open ends, and said electrical substrate is manuallypushed along each respective channel with said first and second pair ofguide rails riding between respective first and second guide means dropguides and top surfaces until each of said first and second pair ofguide rails fall within respective first and second guide means firstand second slots.
 7. The substrate connector guide as claimed in claim6, wherein: each of said guide means terminating ends is a top guideextending into respective first and second guide means channels, eachtop guide arranged to contact said electrical substrate when ridingwithin each respective channel, thereby urging said electrical substratein a downward direction.
 8. A substrate connector guide for mounting andelectrically connecting an electrical substrate to a carrier substratecomprising:rail means mounted along the major perimeter edges of saidelectrical substrate; a plurality of guide means mounted to said carriersubstrate, each of said guide means including a channel extendinglongitudinally along a first side thereof and said channel extendsbetween an open end to a terminating end, each channel including railmeans accepting slots; and, said electrical substrate and said railsmeans arranged to be manually inserted into said guide means channel atrespective channel open ends and urged along said channels toward saidterminating end until said rail means fall within respective rail meansaccepting slots, resting said rails means on said carrier substrate.